IP Library › Assignment 017989/0294
Patent Assignment
Reel/Frame 017989/0294

Assignment of Assignor's Interest

Recorded: 2006-07-25 Pages: 3
Assignor
YOUNG, LEE TAE
Executed: 2006-05-11
Assignee
DONGBU ELECTRONICS CO., LTD.
891-10, DAECHI-DONG, GANGNAM-GU, SEOUL, 135-280, KOREA, REPUBLIC OF
Covered Property (1)
Multi-Layered Copper Line Structure of Semiconductor Device and Method for Forming the Same
Patent: 7,459,787 →
Application: 11/433,037 →
Publication: US 2006/0258151
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jun 6, 2006
From: DONGBU ANAM SEMICONDUCTORS, INC
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017718/0964 →
Corrective Assignment to Correct the Assignor Previously Recorded on Reel 017989 Frame 0294. Assignor(S) Hereby Confirms the Assignment of Entire Interest. Oct 27, 2008
From: LEE, TAE YOUNG
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 021743/0646 →
Assignment of Assignor's Interest May 28, 2014
From: DONGBU HITEK CO., LTD.
To: DSS TECHNOLOGY MANAGEMENT, INC.
Reel/Frame 033035/0680 →