Patent Assignment
Reel/Frame 021743/0646
Corrective Assignment to Correct the Assignor Previously Recorded on Reel 017989 Frame 0294. Assignor(S) Hereby Confirms the Assignment of Entire Interest.
Recorded: 2008-10-27
Pages: 4
Assignor
LEE, TAE YOUNG
Executed: 2008-10-01
Assignee
DONGBU ELECTRONICS CO., LTD.
891-10 DAECHI-DONG, GANGNAM-GU, SEOUL, 135-280, KOREA, REPUBLIC OF
Covered Property
(1)
Multi-Layered Copper Line Structure of Semiconductor Device and Method for Forming the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jun 6, 2006
From: DONGBU ANAM SEMICONDUCTORS, INC
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017718/0964 →
Assignment of Assignor's Interest
Jul 25, 2006
From: YOUNG, LEE TAE
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017989/0294 →
Assignment of Assignor's Interest
May 28, 2014
From: DONGBU HITEK CO., LTD.
To: DSS TECHNOLOGY MANAGEMENT, INC.
Reel/Frame 033035/0680 →