IP Library › Assignment 017996/0682
Patent Assignment
Reel/Frame 017996/0682

Assignment of Assignor's Interest

Recorded: 2006-06-27 Pages: 3
Assignor
HITACHI ULSI SYSTEMS CO., LTD.
Executed: 2006-05-26
Assignee
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Properties (9)
Method of Fabricating Semiconductor Device
Patent: 6,300,206 →
Application: 09/486,899 →
Method of Fabricating Semiconductor Device
Patent: 6,610,564 →
Application: 09/910,794 →
Publication: US 2002/0009857
Method of Fabricating Semiconductor Device
Patent: 6,545,326 →
Application: 09/910,796 →
Publication: US 2001/0051412
Method of Fabricating Semiconductor Device
Patent: 6,670,251 →
Application: 10/005,619 →
Publication: US 2002/0086490
Method of Fabricating Semiconductor Device
Patent: 7,074,665 →
Application: 10/701,423 →
Publication: US 2004/0092078
Method of Fabricating Semiconductor Device
Patent: 7,094,642 →
Application: 11/110,693 →
Publication: US 2005/0186729
Method of Fabricating Semiconductor Device
Patent: 7,118,983 →
Application: 11/169,573 →
Publication: US 2005/0250268
Method of Fabricating Semiconductor Device
Patent: 7,064,040 →
Application: 11/169,574 →
Publication: US 2005/0250269
Method of Fabricating Semiconductor Device
Patent: 7,094,655 →
Application: 11/169,585 →
Publication: US 2005/0239258
Related Assignments (8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 3, 2000
From: FUKADA, SHINICHI; HASHIMOTO, NAOTAKA; KOJIMA, MASANORI; MOMIJI, HIROSHI
To: HITACHI, LTD.; HITACHI ULSI SYSTEMS, CO., LTD.
Reel/Frame 010725/0252 →
Assignment of Assignor's Interest Sep 26, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014570/0380 →
Assignment of Assignor's Interest Jun 27, 2006
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 018011/0942 →
Merger Jul 30, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025204/0512 →
Patent Security Agreement Jun 5, 2020
From: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 052853/0153 →
Release of Security Interest in Patents Jul 8, 2020
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
Reel/Frame 053654/0254 →
Corrective Assignment to Correct the Assignor Name Previously Recorded on Reel 052853 Frame 0153. Assignor(S) Hereby Confirms the Patent Security Agreement. Mar 2, 2021
From: ACACIA RESEARCH GROUP LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 056775/0066 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 053654 Frame: 0254. Assignor(S) Hereby Confirms the Assignment. Jun 10, 2021
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC
Reel/Frame 057454/0045 →