IP Library Assignment 018055/0848
Patent Assignment
Reel/Frame 018055/0848

Assignment of Assignor's Interest

Recorded: 2006-08-04 Pages: 5
Assignors
GUILLERMO, DENNIS
Executed: 2006-07-25
MAGNO, SHEILA RIMA C.
Executed: 2006-07-19
ASOY, MA. SHIRLEY
Executed: 2006-07-25
MARIMUTHU, PANDI CHELVAM
Executed: 2006-07-25
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property (1)
Integrated Circuit Package System with Filled Wafer Recess
Patent: 8,293,584 →
Application: 11/462,509 →
Publication: US 2008/0029847
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0252 →
Release of Security Interest Jun 8, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052864/0057 →
Corrective Assignment to Correct the the Assignee's Name Previously Recorded at Reel: 038378 Frame: 0252. Assignor(S) Hereby Confirms the Assignment. Aug 31, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 065236/0784 →