IP Library › Assignment 018202/0184
Patent Assignment
Reel/Frame 018202/0184

Assignment of Assignor's Interest

Recorded: 2006-08-11 Pages: 2
Assignor
JEONG, DAE HO
Executed: 2006-08-11
Assignee
DONGBU ELECTRONICS CO, LTD.
891-10, DAECHI-DONG, GANGNAM-GU, SEOUL, 135-280, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Device Using Epi-Layer and Method of Forming the Same
Patent: 7,514,337 →
Application: 11/503,020 →
Publication: US 2007/0037360
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger and Change of Name Nov 29, 2017
From: DONGBU ELECTRONICS CO., LTD.; DONGBU HITEK CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 044533/0523 →
Change of Name Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD
Reel/Frame 044555/0913 →
Assignment of Assignor's Interest Jul 10, 2019
From: DB HITEK CO., LTD.
To: COLUMBA TECHNOLOGIES INC.
Reel/Frame 049709/0857 →
Assignment of Assignor's Interest Jun 5, 2020
From: COLUMBA TECHNOLOGIES, INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 052845/0474 →