Patent Assignment
Reel/Frame 018304/0967
Assignment of Assignor's Interest
Recorded: 2006-09-13
Pages: 9
Assignors
NGO, MINH VAN
Executed: 2006-07-21
WILSON, ERIK
Executed: 2006-06-23
PHAM, HIEU
Executed: 2006-07-21
HUERTAS, ROBERT
Executed: 2006-07-21
TOKUNO, HIROKAZU
Executed: 2006-08-21
YOU, LU
Executed: 2006-06-23
NICKEL, ALEXANDER
Executed: 2006-06-23
TRAN, MINH
Executed: 2006-06-27
Assignees
SPANSION LLC
ONE AMD PLACE,, P.O. BOX 3453,, SUNNYVALE, CALIFORNIA, 94088-3453
ADVANCED MICRO DEVICES, INC.
ONE AMD PLACE,, P.O. BOX 3453,, SUNNYVALE, CALIFORNIA, 94088-3453
Covered Property
(1)
Semiconductor Devices with Copper Interconnects and Composite Silicon Nitride Capping Layers
Patent:
7,534,732 →
Application:
11/356,311 →
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
Release of Security Interest
Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
Security Interest
Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
Release of Security Interest
May 17, 2017
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 042486/0315 →
Assignment of Assignor's Interest
Jun 14, 2017
From: SPANSION LLC
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 042702/0460 →
Corrective Assignment to Correct the 8647899 Previously Recorded on Reel 035240 Frame 0429. Assignor(S) Hereby Confirms the Security Interst.
Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →