Patent Assignment
Reel/Frame 018548/0908
Assignment of Assignor's Interest
Recorded: 2006-11-02
Pages: 10
Assignors
DARVEAUX, ROBERT FRANCIS
Executed: 2006-11-01
BARROW, MICHAEL
Executed: 2006-11-01
JIMAREZ, MIGUEL ANGEL
Executed: 2006-11-01
KIM, JAE DONG
Executed: 2006-10-31
PARK, DAE KEUN
Executed: 2006-10-31
LEE, KI WOOK
Executed: 2006-10-31
YOON, JU HOON
Executed: 2006-11-01
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85248-1604
Covered Property
(1)
Exposed Die Overmolded Flip Chip Package and Fabrication Method
Patent:
7,898,093 →
Application:
11/592,889 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
Jun 3, 2009
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 022764/0864 →
Patent Security Agreement
Dec 6, 2012
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 029422/0178 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →