Patent Assignment
Reel/Frame 018605/0827
Change of Name
Recorded: 2006-12-08
Pages: 6
Assignor
LOVOLTECH INC.
Executed: 2006-04-10
Assignee
QSPEED SEMICONDUCTOR INC.
3970 FREEDOM CIRCLE, SANTA CLARA, CALIFORNIA, 95054
Covered Properties
(6)
Flip-Chip Packaging
Method for a Junction Field Effect Transistor with Reduced Gate Capacitance
Patent:
7,452,763 →
Application:
10/776,487 →
Method and Structure for Composite Trench Fill
Patent:
7,265,398 →
Application:
10/816,980 →
Schottky Barrier Rectifier and Method of Manufacturing the Same
Patent:
7,238,976 →
Application:
10/869,718 →
Method of Manufacturing a Schottky Barrier Rectifier
Patent:
7,220,661 →
Application:
11/023,272 →
Mosfet Having a Jfet Embedded as a Body Diode
Patent:
7,417,266 →
Application:
11/149,718 →
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 15, 2004
From: YU, HO-YUAN; LIN, CHONG-MING
To: LOVOLTECH INC.
Reel/Frame 015492/0232 →
Security Agreement
Aug 23, 2004
From: LOVOLTECH, INC.
To: ADAMS CAPITAL MANAGEMENT, III, L.P.
Reel/Frame 015074/0678 →
Assignment of Assignor's Interest
Oct 17, 2005
From: LI, JIAN; CHANG, DANIEL; YU, HO-YUAN
To: LOVOLTECH, INC.
Reel/Frame 017088/0111 →
Merger
Dec 12, 2006
From: QSPEED SEMICONDUCTOR INC.
To: QSPEED SEMICONDUCTOR INC.
Reel/Frame 018616/0298 →
Release of Security Interest
Dec 26, 2006
From: ADAMS CAPITAL MANAGEMENT, III, L.P.
To: QSPEED SEMICONDUCTOR INC. F/K/A LOVOLTECH, INC.
Reel/Frame 018668/0591 →
Security Agreement
Feb 6, 2007
From: QSPEED SEMICONDUCTOR, INC.
To: SILICON VALLEY BANK
Reel/Frame 018855/0591 →
Release
May 22, 2009
From: SILICON VALLEY BANK
To: QSPEED SEMICONDUCTOR INC.
Reel/Frame 022732/0220 →
Assignment of Assignor's Interest
Mar 14, 2011
From: QSPEED SEMICONDUCTOR, INC
To: POWER INTEGRATIONS, INC.
Reel/Frame 025949/0001 →