Flip-chip packaging
View Patent ↗A semiconductor die mounted between an X-lead frame and a support structure without bonding wires or straps. A power enhancement mode junction field effect transistor (JFET) die having a top surface defining a drain, and a bottom surface having a first metalized region defining a source and a second metalized region defining a gate, is positioned on a support structure. An X-lead frame is bonded to the support structure such that electrical contact is made with an external lead. Angular projections from the X-lead frame make contact with the top surface of the JFET, hold the die in place on the support structure, and form electrical continuity between the JFET drain and the external lead. A construction on the surface of the support structure is positioned directly under the source region on the bottom of the JFET die and forms electrical continuity between the JFET source and a second external lead.
1. A system mounting a semiconductor die within a package comprising:
a mounting surface;
an X-lead frame coupled to said mounting surface; and
said semiconductor die, wherein said semiconductor die is disposed between and held in place by said mounting surface and said X-lead frame without bonding to said mounting surface and without bonding to said X-lead frame.
2. A package as described in claim 1 wherein said semiconductor die is a power enhancement mode JFET having a surface region defining a source, a surface region defining a drain and a surface region defining a gate.
3. The power semiconductor package of claim 2 wherein electrical coupling between said drain and said X-lead frame is realized by angular projections of said X-lead frame contacting said drain.
4. The power semiconductor package of claim 2 wherein said X-lead frame is bonded to a first terminal disposed on said mounting surface.
5. The power semiconductor package of claim 2 wherein a second terminal disposed on said mounting surface is electrically connected to said source.
6. The power semiconductor package of claim 2 wherein a third terminal disposed on said mounting surface is electrically connected to said gate.
7. The semiconductor package of claim 1 , wherein said package is sized and shaped to conform to an S08 configuration.
8. The semiconductor package of claim 1 , wherein said first terminal is a solid terminal spanning the full width of four leads and the spaces between four leads on one side of said S08 package.
9. The semiconductor package of claim 1 , wherein said second terminal is a solid terminal spanning a width of three leads and the spaces between three leads on a side of said S08 package opposite to said first terminal.
10. The semiconductor package of claim 1 , wherein said third terminal is a solid terminal spanning a width of a single lead on a side of said S08 package opposite to said first terminal.
11. The semiconductor package of claim 1 wherein said X-lead frame comprises at least one angular extension configured to make physical and electrical contact with said semiconductor die.
12. The semiconductor package of claim 11 wherein said mounting surface comprises at least one source pad configured to make mechanical and electrical contact with said semiconductor die.
13. The semiconductor package of claim 1 wherein said mounting surface comprises at least one source pad configured to make mechanical and electrical contact with said semiconductor die.