IP Library › Assignment 018693/0127
Patent Assignment
Reel/Frame 018693/0127

Assignment of Assignor's Interest

Recorded: 2006-12-29 Pages: 4
Assignor
PARK, KEUN SOO
Executed: 2006-12-23
Assignee
DONGBU ELECTRONICS CO., LTD.
891-10 DAECHI-DONG, GANGNAM-GU, SEOUL, 135-280, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Device
Patent: 7,485,578 →
Application: 11/617,057 →
Publication: US 2007/0155175
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger and Change of Name Nov 29, 2017
From: DONGBU ELECTRONICS CO., LTD.; DONGBU HITEK CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 044533/0523 →
Change of Name Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD
Reel/Frame 044555/0913 →
Assignment of Assignor's Interest Jul 10, 2019
From: DB HITEK CO., LTD.
To: COLUMBA TECHNOLOGIES INC.
Reel/Frame 049709/0857 →