Patent Assignment
Reel/Frame 018712/0193
Assignment of Assignor's Interest
Recorded: 2006-12-15
Pages: 2
Assignor
YUN, YEO-JO
Executed: 2006-12-05
Assignee
DONGBU ELECTRONICS CO., LTD.
891-10, DAECHI-DONG, GANGNAM-GU,, SEOUL, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger and Change of Name
Nov 29, 2017
From: DONGBU ELECTRONICS CO., LTD.; DONGBU HITEK CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 044533/0523 →
Change of Name
Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD
Reel/Frame 044555/0913 →
Assignment of Assignor's Interest
Jul 10, 2019
From: DB HITEK CO., LTD.
To: COLUMBA TECHNOLOGIES INC.
Reel/Frame 049709/0857 →