Patent Assignment
Reel/Frame 018967/0227
Assignment of Assignor's Interest
Recorded: 2007-03-06
Pages: 3
Assignors
GREISEN, CHRISTOFFER GRAAE
Executed: 2007-01-12
SHIV, LIOR
Executed: 2007-01-12
EGGINTON, PAUL N.
Executed: 2007-01-12
Assignee
HYMITE A/S
DIPLOMVEJ, 2800 KGS., LYNGBY, DENMARK
Covered Property
(1)
Spacers for Wafer Bonding
Application:
11/621,045 →
Publication:
US 2008/0164606
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 30, 2010
From: HYMITE A/S
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 025403/0566 →
Assignment of Assignor's Interest
Sep 3, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: CHIP STAR LTD.
Reel/Frame 036543/0245 →
Merger
Mar 26, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 038107/0949 →