IP Library Assignment 019001/0028
Patent Assignment
Reel/Frame 019001/0028

Assignment of Assignor's Interest

Recorded: 2007-03-13 Pages: 5
Assignors
SLATER, DAVID B., JR
Executed: 2007-02-14
EDMOND, JOHN A.
Executed: 2007-02-13
KONG, HUA-SHUANG
Executed: 2007-03-05
Assignee
CREE, INC.
4600 SILICON DRIVE, DURHAM, NORTH CAROLINA, 27703
Covered Property (1)
Modified Gold-Tin System with Increased Melting Temperature for Wafer Bonding
Patent: 7,855,459 →
Application: 11/534,317 →
Publication: US 2008/0073665
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 1, 2021
From: CREE, INC.
To: CREE LED, INC.
Reel/Frame 056012/0200 →
Security Interest Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
Release of Patent Security Interest Recorded at R/F 058983/0001 Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
Patent Security Agreement Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
Corrective Assignment to Correct the Name of the Assignee Previously Recorded on Reel 56012 Frame 200. Assignor(S) Hereby Confirms the Assignment. Jul 9, 2025
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 071874/0001 →