IP Library › Assignment 019329/0251
Patent Assignment
Reel/Frame 019329/0251

Assignment of Assignor's Interest

Recorded: 2007-05-22 Pages: 4
Assignor
RINNE, GLENN A.
Executed: 2007-01-23
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85248-1604
Covered Property (1)
Electronic Devices Including Solder Bumps on Compliant Dielectric Layers
Patent: 7,932,615 →
Application: 11/671,026 →
Publication: US 2007/0182004
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement Jun 3, 2009
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 022764/0864 →
Patent Security Agreement Dec 6, 2012
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 029422/0178 →
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →