IP Library › Assignment 019633/0246
Patent Assignment
Reel/Frame 019633/0246

Assignment of Assignor's Interest

Recorded: 2007-08-01 Pages: 5
Assignors
TOPACIO, RODEN R.
Executed: 2007-08-01
LOW, YIP SENG
Executed: 2007-08-01
MCLELLAN, NEIL
Executed: 2007-08-01
LEUNG, ANDREW KW
Executed: 2007-08-01
Assignee
ADVANCED MICRO DEVICES, INC.
ONE AMD PLACE, PO BOX 3453, KEVIN O'NEIL, SUNNYVALE, CALIFORNIA, 94088-3453
Covered Property (1)
Conductor Bump Method and Apparatus
Patent: 7,906,424 →
Application: 11/832,486 →
Publication: US 2009/0032940
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 22, 2016
From: ADVANCED MICRO DEVICES, INC.
To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
Reel/Frame 037876/0790 →
Amended and Restated U.S. Patent Security Agreement (for Non-U.S. Grantors) Aug 22, 2018
From: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
To: CPPIB CREDIT INVESTMENTS, INC.
Reel/Frame 046900/0136 →
Release of Security Interest Nov 10, 2020
From: CPPIB CREDIT INVESTMENTS INC.
To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
Reel/Frame 054372/0194 →
Assignment of Assignor's Interest Jul 29, 2021
From: MOSAID TECHNOLOGIES INC.
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 057024/0919 →