Patent Assignment
Reel/Frame 019921/0982
Assignment of Assignor's Interest
Recorded: 2007-10-04
Pages: 4
Assignors
RUSLI, SUKIANTO
Executed: 2007-10-01
KUO, BOB SHIH-WEI
Executed: 2007-10-01
HUEMOELLER, RONALD PATRICK
Executed: 2007-10-01
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Property
(1)
Wafer Level Package Utilizing Laser-Activated Dielectric Material
Patent:
7,632,753 →
Application:
11/867,293 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
Jun 3, 2009
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 022764/0864 →
Patent Security Agreement
Dec 6, 2012
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 029422/0178 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →