Patent Assignment
Reel/Frame 020223/0487
Assignment of Assignor's Interest
Recorded: 2007-12-10
Pages: 6
Assignors
HUEMOELLER, RONALD PATRICK
Executed: 2007-11-11
RUSLI, SUKIANTO
Executed: 2007-11-27
KUO, BOB SHIH-WEI
Executed: 2007-11-09
ADAY, JON GREGORY
Executed: 2007-11-28
SMITH, LEE JOHN
Executed: 2007-11-09
DARVEAUX, ROBERT F
Executed: 2007-11-27
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Property
(1)
Thin Substrate Fabrication Method and Structure
Patent:
8,017,436 →
Application:
11/953,680 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
Jun 3, 2009
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 022764/0864 →
Patent Security Agreement
Dec 6, 2012
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 029422/0178 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →