Patent Assignment
Reel/Frame 020374/0756
Assignment of Assignor's Interest
Recorded: 2008-01-16
Pages: 3
Assignors
KIM, DO HYEONG
Executed: 2008-01-09
KIM, BONG CHAN
Executed: 2008-01-09
CHUNG, JI YOUNG
Executed: 2008-01-09
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE RD., CHANDLER, ARIZONA, 92656
Covered Property
(1)
Semiconductor Package with Patterning Layer and Method of Making Same
Patent:
7,956,453 →
Application:
12/015,428 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
Jun 3, 2009
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 022764/0864 →
Patent Security Agreement
Dec 6, 2012
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 029422/0178 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →