Patent Assignment
Reel/Frame 020562/0967
Assignment of Assignor's Interest
Recorded: 2008-02-22
Pages: 5
Assignors
CHIN, CHEE KEONG
Executed: 2008-02-11
YEE, JAE HAK
Executed: 2008-02-11
FENG, YU FENG
Executed: 2008-02-11
SANTOS, FREDERICK CRUZ
Executed: 2008-02-11
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Integrated Circuit Package-in-Package System Housing a Plurality of Stacked and Offset Integrated Circuits and Method of Manufacture Therefor
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0145 →
Release of Security Interest
Jun 4, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052844/0491 →
Corrective Assignment to Correct the Receiving Party Name on the Cover Sheet Previously Recorded at Reel: 038378 Frame: 0145. Assignor(S) Hereby Confirms the Assignment.
Sep 5, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064806/0001 →