IP Library Assignment 020724/0077
Patent Assignment
Reel/Frame 020724/0077

Assignment of Assignor's Interest

Recorded: 2008-03-29 Pages: 5
Assignors
CAMACHO, ZIGMUND RAMIREZ
Executed: 2008-03-26
TAY, LIONEL CHIEN HUI
Executed: 2008-03-26
BATHAN, HENRY DESCALZO
Executed: 2008-03-26
ADVINCULA, ABELARDO JR. HADAP
Executed: 2008-03-26
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property (1)
Integrated Circuit Package System with Planar Interconnect
Patent: 9,059,074 →
Application: 12/055,526 →
Publication: US 2009/0243082
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Nov 20, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 037096/0315 →
Change of Name Jul 22, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 039428/0928 →
Release of Security Interest Jun 18, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052972/0001 →