IP Library › Assignment 020980/0179
Patent Assignment
Reel/Frame 020980/0179

Assignment of Assignor's Interest

Recorded: 2008-05-21 Pages: 5
Assignors
STONEHAM, EDWARD B.
Executed: 2004-10-11
GAUDETTE, THOMAS M.
Executed: 2004-10-12
Assignee
ENDWAVE CORPORATION
130 BAYTECH DRIVE, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Chip Mounting with Flowable Layer
Patent: 7,588,966 →
Application: 12/042,144 →
Publication: US 2008/0153206
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Amended and Restated Intellectual Property Security Agreement Apr 6, 2016
From: ENDWAVE CORPORATION
To: SILICON VALLEY BANK
Reel/Frame 038372/0393 →
Release of Security Interest Apr 5, 2017
From: SILICON VALLEY BANK
To: ENDWAVE CORPORATION
Reel/Frame 042166/0194 →
Security Agreement Apr 5, 2017
From: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; MAGNUM SEMICONDUCTOR, INC.; ENDWAVE CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 042166/0431 →
Assignment of Assignor's Interest Aug 4, 2017
From: ENDWAVE CORPORATION
To: INTEGRATED DEVICE TECHNOLOGY, INC.
Reel/Frame 043207/0542 →
Release of Security Interest Mar 29, 2019
From: JPMORGAN CHASE BANK, N.A.
To: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; CHIPX, INCORPORATED; ENDWAVE CORPORATION
Reel/Frame 048746/0001 →