Patent Assignment
Reel/Frame 021061/0622
Assignment of Assignor's Interest
Recorded: 2008-06-06
Pages: 5
Assignors
TAY, LIONEL CHIEN HUI
Executed: 2008-05-29
CHOW, SENG GUAN
Executed: 2008-05-29
CAMACHO, ZIGMUND RAMIREZ
Executed: 2008-05-29
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Semiconductor Package System with Cut Multiple Lead Pads
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Nov 20, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 037096/0315 →
Change of Name
Jul 22, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 039428/0928 →
Release of Security Interest
Jun 18, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052972/0001 →