Semiconductor package system with cut multiple lead pads

1. A method of manufacture of a semiconductor package system comprising:

providing a leadframe having an inner frame bar, an outer frame bar, a die pad, tiebars, and rows of leads including inner leads, outer leads, and an outer lead pad adjacent the outer leads with the inner frame bar and the outer frame bar integrally connected to the rows of leads and the inner frame bar coplanar with the outer frame bar, wherein the outer leads and the outer lead pad are in one of the rows of leads, the outer lead pad is directly in between the outer leads, the outer lead pad is formed by fusing a few of the outer leads together, and the outer lead pad having a pad width greater than a lead width of each of the outer leads;

attaching a semiconductor chip to the die pad;

attaching bond wires between the semiconductor chip and the rows of leads;

encapsulating the semiconductor chip, the bond wires, the inner frame bar, the outer frame bar, the die pad, the tiebars, and the rows of leads in an encapsulant;

cutting a groove in the encapsulant along a row of the inner leads to remove the inner frame bar, the groove in the encapsulant perpendicular to and passing through a row of the outer leads, the outer leads have outer lead inner surfaces fully embedded in the encapsulant, the outer lead inner surfaces have an inner surface height the same as a lead height of the outer leads and the inner leads, the inner leads have inner lead outer surfaces fully exposed in the groove, the inner lead outer surfaces have an outer surface height the same as the lead height, the groove has a groove depth equal to the lead height, the groove is directly in between the outer lead inner surfaces and the inner lead outer surfaces; and

singulating the leadframe and the encapsulant to remove the outer frame bar.

2. The method as claimed in claim 1 wherein providing the leadframe includes providing more than two of the rows of leads.

3. The method as claimed in claim 1 wherein providing the leadframe includes providing multiple lead pads.

4. A semiconductor package system comprising:

a die pad;

rows of leads adjacent to the die pad, with the rows of leads being coplanar, the rows of leads including inner leads, outer leads, and an outer lead pad adjacent the outer leads, wherein the outer leads and the outer lead pad are in one of the rows of leads, the outer lead pad is directly in between the outer leads, the outer lead pad is formed by fusing a few of the outer leads together, and the outer lead pad having a pad width greater than a lead width of each of the outer leads;

a semiconductor chip attached to the die pad;

bond wires connected to the semiconductor chip and the rows of leads; and

an encapsulant over the semiconductor chip, the bond wires, the die pad, and the rows of leads, the encapsulant having a groove cut therein along a row of the inner leads for isolating the inner leads, the groove in the encapsulant perpendicular to and passing through a row of the outer leads, the outer leads have outer lead inner surfaces fully embedded in the encapsulant, the outer lead inner surfaces have an inner surface height the same as a lead height of the outer leads and the inner leads, the inner leads have inner lead outer surfaces fully exposed in the groove, the inner lead outer surfaces have an outer surface height the same as the lead height, the groove has a groove depth equal to the lead height, the groove is directly in between the outer lead inner surfaces and the inner lead outer surfaces.

5. The system as claimed in claim 4 wherein the rows of leads include more than two of the rows of leads.

6. The system as claimed in claim 4 wherein the rows of leads include multiple lead pads.