Patent Assignment
Reel/Frame 021068/0367
Assignment of Assignor's Interest
Recorded: 2008-06-09
Pages: 5
Assignors
OH, JIHOON
Executed: 2008-05-30
LEE, KYUWON
Executed: 2008-05-30
LIM, JAEHYUN
Executed: 2008-05-30
PARK, JONGVIN
Executed: 2008-05-30
LEE, SINJAE
Executed: 2008-05-30
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Package-On-Package System with Heat Spreader
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0328 →
Release of Security Interest
Jun 15, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052935/0327 →
Correct Error in Assignment Name from Stats Chippac Pte. Lte. to Stats Chippac Pte. Ltd. (Reel: 038378 Frame: 0328
Aug 30, 2023
From: STATS CHIPPAC PTE. LTE.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 064838/0948 →
Change of Name
Oct 13, 2025
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 073061/0567 →
Assignment of Assignor's Interest
Dec 4, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 073833/0156 →