Patent Assignment
Reel/Frame 021068/0646
Change of the Address of the Assignee
Recorded: 2008-06-10
Pages: 4
Assignor
POWERCHIP SEMICONDUCTOR CORP.
Executed: 2008-06-09
Assignee
POWERCHIP SEMICONDUCTOR CORP.
NO. 12, LI-HSIN RD. I, SCIENCE PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Method of Managing Wafer Defects
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 9, 2004
From: TAI, HUNG-EN; CHEN, CHIA-YUN; WANG, SHENG-JEN
To: POWERCHIP SEMICONDUCTOR CORP.
Reel/Frame 015102/0436 →
Change of Name
Jun 28, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049629/0240 →
Assignment of Assignor's Interest
Jul 14, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049746/0981 →