Patent Assignment
Reel/Frame 021525/0388
Assignment of Assignor's Interest
Recorded: 2008-09-12
Pages: 5
Assignors
BAE, HYUNIL
Executed: 2008-09-10
KIM, YOUNGCHUL
Executed: 2008-09-10
LEE, MYUNGKIL
Executed: 2008-09-10
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming a Fan-in Package-on-Package Structure Using Through-Silicon Vias
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0442 →
Corrective Assignment to Correct the Assignor Name Previously Recorded at Reel: 039514 Frame: 0451. Assignor(S) Hereby Confirms the Change of Name.
Aug 26, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 039980/0838 →
Release of Security Interest
Jun 17, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 053476/0094 →
Assignment of Assignor's Interest
Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →