Patent Assignment
Reel/Frame 021650/0048
Assignment of Assignor's Interest
Recorded: 2008-10-08
Pages: 5
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Planar Encapsulation and Mold Cavity Package in Package System
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Date of Execution of Second Assignor from 09/28/2008 to 9/23/2008 Previously Recorded on Reel 021650 Frame 0048. Assignor(S) Hereby Confirms the 09/23/2008.
Oct 10, 2008
From: PAGAILA, REZA ARGENTY
To: STATS CHIPPAC LTD.
Reel/Frame 021666/0051 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 11, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038401/0532 →
Release of Security Interest
Jun 5, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052850/0237 →
Corrective Assignment to Correct the Correct the Spelling of Assignee's Name from "Stats Chippac Pte. Lte," to "Stats Chippac Pte. Ltd." Previously Recorded at Reel: 038401 Frame: 0532. Assignor(S) Hereby Confirms the Assignment.
Sep 1, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064803/0109 →
Assignment of Assignor's Interest
Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →