Patent Assignment
Reel/Frame 022032/0083
Assignment of Assignor's Interest
Recorded: 2008-12-29
Pages: 4
Assignors
DAUBENSPECK, TIMOTHY H
Executed: 2008-08-12
GAMBINO, JEFFREY P
Executed: 2008-08-14
MUZZY, CHRISTOPHER D
Executed: 2008-08-25
SAUTER, WOLFGANG
Executed: 2008-08-25
SULLIVAN, TIMOTHY D
Executed: 2008-08-13
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Structures and Methods for Improving Solder Bump Connections in Semiconductor Devices
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest
Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →
Security Agreement
Nov 29, 2018
From: GLOBALFOUNDRIES INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 049490/0001 →
Assignment of Assignor's Interest
Aug 21, 2019
From: GLOBALFOUNDRIES INC.
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 050122/0001 →
Assignment of Assignor's Interest
Nov 20, 2019
From: GLOBALFOUNDRIES U.S. INC.
To: MARVELL INTERNATIONAL LTD.
Reel/Frame 051070/0625 →
Assignment of Assignor's Interest
Feb 20, 2020
From: MARVELL INTERNATIONAL LTD.
To: CAVIUM INTERNATIONAL
Reel/Frame 052918/0001 →
Assignment of Assignor's Interest
Jun 16, 2020
From: CAVIUM INTERNATIONAL
To: MARVELL ASIA PTE, LTD.
Reel/Frame 053475/0001 →
Release of Security Interest
Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →