Patent Assignment
Reel/Frame 022177/0889
Assignment of Assignor's Interest
Recorded: 2009-01-29
Pages: 7
Assignors
LUDWIG, DAVID
Executed: 2009-01-28
CLARK, STEWART
Executed: 2009-01-28
BOYD, W. ERIC
Executed: 2009-01-28
YAMAGUCHI, JAMES
Executed: 2009-01-28
Assignee
IRVINE SENSORS CORPORATION
3001 REDHILL AVE., BUILDING 4, SUITE 108, COSTA MESA, CALIFORNIA, 92626
Covered Property
(1)
Method for Precision Integrated Circuit Die Singulation Using Differential Etch Rates
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jan 5, 2007
From: IRVINE SENSORS CORP.
To: LONGVIEW FUND, L.P.; ALPHA CAPITAL ANSTALT
Reel/Frame 018746/0842 →
Assignment of Assignor's Interest
Jan 22, 2009
From: LUDWIG, DAVID; CLARK, STEWART; BOYD, W. ERIC; YAMAGUCHI, JAMES SATSUO
To: IRVINE SENSORS CORPORATION
Reel/Frame 022151/0079 →
Assignment of Assignor's Interest
May 4, 2009
From: IRVINE SENSORS CORPORATION
To: APROLASE DEVELOPMENT CO., LLC
Reel/Frame 022632/0066 →
Release of Security Interest
Jul 22, 2011
From: LONGVIEW FUND, L.P.; ALPHA CAPITAL ANSTALT
To: IRVINE SENSORS CORPORATION
Reel/Frame 026632/0405 →
Merger
Dec 30, 2015
From: APROLASE DEVELOPMENT CO., LLC
To: NYTELL SOFTWARE LLC
Reel/Frame 037406/0200 →