IP Library › Assignment 022632/0066
Patent Assignment
Reel/Frame 022632/0066

Assignment of Assignor's Interest

Recorded: 2009-05-04 Pages: 18
Assignor
IRVINE SENSORS CORPORATION
Executed: 2009-03-16
Assignee
APROLASE DEVELOPMENT CO., LLC
2711 CENTERVILLE ROAD, SUITE 400, WILMINGTON, DELAWARE, 19808
Covered Property (1)
Method for Precision Integrated Circuit Die Singulation Using Differential Etch Rates
Patent: 7,335,576 →
Application: 11/197,828 →
Publication: US 2006/0079072
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jan 5, 2007
From: IRVINE SENSORS CORP.
To: LONGVIEW FUND, L.P.; ALPHA CAPITAL ANSTALT
Reel/Frame 018746/0842 →
Assignment of Assignor's Interest Jan 22, 2009
From: LUDWIG, DAVID; CLARK, STEWART; BOYD, W. ERIC; YAMAGUCHI, JAMES SATSUO
To: IRVINE SENSORS CORPORATION
Reel/Frame 022151/0079 →
Assignment of Assignor's Interest Jan 29, 2009
From: LUDWIG, DAVID; CLARK, STEWART; BOYD, W. ERIC; YAMAGUCHI, JAMES
To: IRVINE SENSORS CORPORATION
Reel/Frame 022177/0889 →
Release of Security Interest Jul 22, 2011
From: LONGVIEW FUND, L.P.; ALPHA CAPITAL ANSTALT
To: IRVINE SENSORS CORPORATION
Reel/Frame 026632/0405 →
Merger Dec 30, 2015
From: APROLASE DEVELOPMENT CO., LLC
To: NYTELL SOFTWARE LLC
Reel/Frame 037406/0200 →