Patent Assignment
Reel/Frame 022186/0106
Assignment of Assignor's Interest
Recorded: 2009-01-28
Pages: 11
Assignors
ALBERT, DOUGLAS MAURICE
Executed: 2004-01-08
OZGUZ, VOLKAN H.
Executed: 2004-01-07
CAMIEN, ANDREW
Executed: 2004-01-14
YAMAGUCHI, JAMES
Executed: 2004-01-12
PEPE, ANGEL A.
Executed: 2004-01-08
Assignee
IRVINE SENSORS CORPORATION
3001 REDHILL AVENUE, BUILDING 4, SUITE 108, COSTA MESA, CALIFORNIA, 92626
Covered Property
(1)
Stackable Semiconductor Chip Layer Comprising Prefabricated Trench Interconnect Vias
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jan 5, 2007
From: IRVINE SENSORS CORP.
To: LONGVIEW FUND, L.P.; ALPHA CAPITAL ANSTALT
Reel/Frame 018746/0842 →
Assignment of Assignor's Interest
Feb 27, 2009
From: PEPE, ANGEL; OZGUZ, VOLKAN; CAMIEN, ANDREW; YAMAGUCHI, JAMES
To: IRVINE SENSORS CORPORATION
Reel/Frame 022333/0549 →
Assignment of Assignor's Interest
Apr 21, 2009
From: IRVINE SENSORS CORPORATION
To: APROLASE DEVELOPMENT CO., LLC
Reel/Frame 022570/0094 →
Release of Security Interest
May 11, 2010
From: LONGVIEW FUND, L.P.; ALPHA CAPITAL ANSTALT
To: IRVINE SENSORS CORPORATION
Reel/Frame 024367/0385 →
Merger
Dec 30, 2015
From: APROLASE DEVELOPMENT CO., LLC
To: NYTELL SOFTWARE LLC
Reel/Frame 037406/0200 →