IP Library › Assignment 024367/0385
Patent Assignment
Reel/Frame 024367/0385

Release of Security Interest

Recorded: 2010-05-11 Pages: 48
Assignors
LONGVIEW FUND, L.P.
Executed: 2009-02-27
ALPHA CAPITAL ANSTALT
Executed: 2009-02-27
Assignee
IRVINE SENSORS CORPORATION
3001 REDHILL AVE. BUILDING 4, SUITE 108, COSTA MESA, CALIFORNIA, 92626
Covered Property (1)
Stackable Semiconductor Chip Layer Comprising Prefabricated Trench Interconnect Vias
Patent: 7,786,562 →
Application: 11/150,712 →
Publication: US 2005/0277288
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jan 5, 2007
From: IRVINE SENSORS CORP.
To: LONGVIEW FUND, L.P.; ALPHA CAPITAL ANSTALT
Reel/Frame 018746/0842 →
Assignment of Assignor's Interest Jan 28, 2009
From: ALBERT, DOUGLAS MAURICE; OZGUZ, VOLKAN H.; CAMIEN, ANDREW; YAMAGUCHI, JAMES
To: IRVINE SENSORS CORPORATION
Reel/Frame 022186/0106 →
Assignment of Assignor's Interest Feb 27, 2009
From: PEPE, ANGEL; OZGUZ, VOLKAN; CAMIEN, ANDREW; YAMAGUCHI, JAMES
To: IRVINE SENSORS CORPORATION
Reel/Frame 022333/0549 →
Assignment of Assignor's Interest Apr 21, 2009
From: IRVINE SENSORS CORPORATION
To: APROLASE DEVELOPMENT CO., LLC
Reel/Frame 022570/0094 →
Merger Dec 30, 2015
From: APROLASE DEVELOPMENT CO., LLC
To: NYTELL SOFTWARE LLC
Reel/Frame 037406/0200 →