IP Library › Assignment 022570/0094
Patent Assignment
Reel/Frame 022570/0094

Assignment of Assignor's Interest

Recorded: 2009-04-21 Pages: 18
Assignor
IRVINE SENSORS CORPORATION
Executed: 2009-03-16
Assignee
APROLASE DEVELOPMENT CO., LLC
2711 CENTERVILLE ROAD, SUITE 400, WILMINGTON, DELAWARE, 19808
Covered Property (1)
Stackable Semiconductor Chip Layer Comprising Prefabricated Trench Interconnect Vias
Patent: 7,786,562 →
Application: 11/150,712 →
Publication: US 2005/0277288
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jan 5, 2007
From: IRVINE SENSORS CORP.
To: LONGVIEW FUND, L.P.; ALPHA CAPITAL ANSTALT
Reel/Frame 018746/0842 →
Assignment of Assignor's Interest Jan 28, 2009
From: ALBERT, DOUGLAS MAURICE; OZGUZ, VOLKAN H.; CAMIEN, ANDREW; YAMAGUCHI, JAMES
To: IRVINE SENSORS CORPORATION
Reel/Frame 022186/0106 →
Assignment of Assignor's Interest Feb 27, 2009
From: PEPE, ANGEL; OZGUZ, VOLKAN; CAMIEN, ANDREW; YAMAGUCHI, JAMES
To: IRVINE SENSORS CORPORATION
Reel/Frame 022333/0549 →
Release of Security Interest May 11, 2010
From: LONGVIEW FUND, L.P.; ALPHA CAPITAL ANSTALT
To: IRVINE SENSORS CORPORATION
Reel/Frame 024367/0385 →
Merger Dec 30, 2015
From: APROLASE DEVELOPMENT CO., LLC
To: NYTELL SOFTWARE LLC
Reel/Frame 037406/0200 →