Patent Assignment
Reel/Frame 022469/0852
Assignment of Assignor's Interest
Recorded: 2009-03-30
Pages: 4
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, L.L.C.
5005 E. MCDOWELL ROAD, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Method of Forming an Eeprom Device and Structure Therefor
Patent:
7,776,677 →
Application:
12/414,071 →
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Jun 15, 2009
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 022827/0819 →
Security Interest
Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
Release of Security Interest
May 6, 2016
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038631/0345 →
Release of Security Interest
May 6, 2016
From: JPMORGAN CHASE BANK, N.A. (ON ITS BEHALF AND ON BEHALF OF ITS PREDECESSOR IN INTEREST, CHASE MANHATTAN BANK)
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038632/0074 →
Corrective Assignment to Correct the Incorrect Patent Number 5859768 and to Recite Collateral Agent Role of Receiving Party in the Security Interest Previously Recorded on Reel 038620 Frame 0087. Assignor(S) Hereby Confirms the Security Interest.
Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
Release of Security Interest in Patents Recorded at Reel 038620, Frame 0087
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →