Patent Assignment
Reel/Frame 022827/0819
Security Agreement
Recorded: 2009-06-15
Pages: 11
Assignor
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Executed: 2009-06-10
Assignee
JPMORGAN CHASE BANK, N.A.
270 PARK AVENUE, NEW YORK, NEW YORK, 10017
Covered Properties
(14)
Scalable Electrically Eraseable and Programmable Memory
PCT:
PCT/US2009/034973 ↗
Digital Automatic Gain Control
Application:
12/356,256 →
Publication:
US 2009/0208033
Semiconductor Component and Method of Manufacture
Method for Manufacturing a Semiconductor Component
Method for Manufacturing a Semiconductor Component and Structure Therefor
Temperature Compensated Current Source and Method Therefor
Application:
12/364,242 →
Publication:
US 2010/0194465
Method of Forming a Control Circuit and Device
Method of Forming Low Capacitance Esd Device and Structure Therefor
Method for Regulating Temperature
Bi-Directional Transistor with by-Pass Path and Method Therefor
Method of Forming a Sensing Circuit and Structure Therefor
Method of Forming an Eeprom Device and Structure Therefor
Patent:
7,776,677 →
Application:
12/414,071 →
Parasitic Element Compensation Circuit and Method for Compensating for the Parasitic Element
Method for Detecting a Fault Condition
Related Assignments
(17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 23, 2009
From: GRIVNA, GORDON M.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 022150/0139 →
Assignment of Assignor's Interest
Jan 26, 2009
From: GRIVNA, GORDON M.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, L.L.C.
Reel/Frame 022153/0806 →
Assignment of Assignor's Interest
Jan 29, 2009
From: CELAYA, PHILLIP; LETTERMAN, JAMES P., JR.; MARQUIS, ROBERT L.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, L.L.C.
Reel/Frame 022175/0589 →
Assignment of Assignor's Interest
Feb 2, 2009
From: SALIH, ALI; KEENA, THOMAS; HALL, JEFFERSON W.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, L.L.C.
Reel/Frame 022190/0823 →
Assignment of Assignor's Interest
Feb 9, 2009
From: PETROIANU, ALEXANDRA-OANA; AUNGURENCEI, GABRIEL CODRIN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, L.L.C.
Reel/Frame 022225/0174 →
Assignment of Assignor's Interest
Mar 30, 2009
From: TYLER, MATTHEW; NAUGHTON, JOHN J.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, L.L.C.
Reel/Frame 022469/0852 →
Assignment of Assignor's Interest
Mar 31, 2009
From: STULER, ROMAN; PTACEK, KAREL
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 022475/0249 →
Assignment of Assignor's Interest
Mar 31, 2009
From: DE COCK, BART
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 022476/0408 →
Assignment of Assignor's Interest
Apr 13, 2009
From: MASSIE, HAROLD L.; CARTER, JARVIS LEROY, SR.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 022537/0825 →
Purchase Agreement Dated 28 February 2009
Sep 25, 2009
From: AMI SEMICONDUCTOR, INC.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 023282/0465 →
Release of Security Interest
Apr 1, 2016
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038171/0445 →
Release of Security Interest
Apr 12, 2016
From: BANK OF AMERICA, N.A., AS SUCCESSOR BY MERGER TO LASALLE BANK
To: STARKEY LABORATORIES, INC.
Reel/Frame 038256/0889 →
Security Interest
Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
Release of Security Interest
May 6, 2016
From: JPMORGAN CHASE BANK, N.A. (ON ITS BEHALF AND ON BEHALF OF ITS PREDECESSOR IN INTEREST, CHASE MANHATTAN BANK)
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038632/0074 →
Release of Security Interest
May 6, 2016
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038631/0345 →
Corrective Assignment to Correct the Incorrect Patent Number 5859768 and to Recite Collateral Agent Role of Receiving Party in the Security Interest Previously Recorded on Reel 038620 Frame 0087. Assignor(S) Hereby Confirms the Security Interest.
Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
Release of Security Interest in Patents Recorded at Reel 038620, Frame 0087
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →