Patent Assignment
Reel/Frame 022488/0360
Assignment of Assignor's Interest
Recorded: 2009-04-01
Pages: 6
Assignors
KIM, BONG CHAN
Executed: 2009-02-23
KIM, DO HYUNG
Executed: 2009-02-20
HWANG, CHAN HA
Executed: 2009-02-23
LEE, MIN WOO
Executed: 2009-02-20
SOHN, EUN SOOK
Executed: 2009-02-23
KANG, WON JOON
Executed: 2009-02-20
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE RD., CHANDLER, ARIZONA, 82548
Covered Property
(1)
Reduced Profile Stackable Semiconductor Package
Patent:
8,026,589 →
Application:
12/390,999 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
Jun 3, 2009
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 022764/0864 →
Patent Security Agreement
Dec 6, 2012
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 029422/0178 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →