Patent Assignment
Reel/Frame 022489/0613
By Merger, of March 8, 2007, Aprio Technologies, Inc. Is a Wholly Owend Subsidiary of Blaze Dmf, Inc.
Recorded: 2009-04-01
Pages: 8
Assignor
APRIO TECHNOLOGIES, INC.
Executed: 2007-03-08
Assignee
BLAZE DFM INC.
1286 ORLEANS DRIVE, SUNNYVALE, CALIFORNIA, 94086
Covered Properties
(5)
Method and Platform for Integrated Physical Verifications and Manufacturing Enhancements
Method and apparatus for selective, incremental, reconfigurable and reusable semiconductor manufacturing resolution-enhancements
Application:
10/820,260 →
Publication:
US 2005/0229130
Intermediate Layout for Resolution Enhancement in Semiconductor Fabrication
Flexible Shape Identification for Optical Proximity Correction in Semiconductor Fabrication
Intermediate Layout for Resolution Enhancement in Semiconductor Fabrication
Related Assignments
(10)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 18, 2003
From: WU, SHAO-PO; HO, TSZ-TAK DANIEL
To: APRIO TECHNOLOGIES INC
Reel/Frame 014424/0808 →
Assignment of Assignor's Interest
Apr 7, 2004
From: WU, SHAO-PO; WANG, XIN; TANG, HONGBO; HUNG, MEG
To: APRIO TECHNOLOGIES, INC.
Reel/Frame 015202/0730 →
Assignment of Assignor's Interest
Mar 7, 2005
From: WU, SHAO-PO; WANG, XIN; TANG, HONGBO; HUNG, MEG
To: APRIO TECHNOLOGIES, INC.
Reel/Frame 016366/0869 →
Assignment of Assignor's Interest
Mar 24, 2005
From: WU, SHAO-PO; WANG, XIN; PILLOFF, MARK
To: APRIO TECHNOLOGIES, INC.
Reel/Frame 016421/0306 →
Assignment of Assignor's Interest
Apr 10, 2008
From: WU, SHAO-PO; WANG, XIN; TANG, HONGBO; HUNG, MEG
To: APRIO TECHNOLOGIES, INC.
Reel/Frame 020786/0266 →
Assignment of Assignor's Interest
Mar 12, 2009
From: BLAZE DFM INC.
To: TELA INNOVATIONS, INC
Reel/Frame 022388/0032 →
Assignment of Assignor's Interest
Jun 7, 2021
From: TELA INNOVATIONS, INC.
To: RPX CORPORATION
Reel/Frame 056602/0001 →
Patent Security Agreement
Apr 21, 2023
From: RPX CORPORATION
To: BARINGS FINANCE LLC, AS COLLATERAL AGENT
Reel/Frame 063424/0569 →
Release of Lien on Patents
Aug 5, 2024
From: BARINGS FINANCE LLC
To: RPX CORPORATION
Reel/Frame 068328/0278 →
Patent Security Agreement
Aug 6, 2024
From: RPX CORPORATION; RPX CLEARINGHOUSE LLC
To: BARINGS FINANCE LLC, AS COLLATERAL AGENT
Reel/Frame 068328/0674 →