Patent Assignment
Reel/Frame 022534/0603
Assignment of Assignor's Interest
Recorded: 2009-04-10
Pages: 4
Assignor
SUAYA, ROBERTO
Executed: 2009-03-09
Assignee
MENTOR GRAPHICS CORPORATION
8005 SW BOECKMAN ROAD, WILSONVILLE, OREGON, 97070-7777
Covered Properties
(3)
High-Frequency Vlsi Interconnect and Intentional Inductor Impedance Extraction in the Presence of a Multi-Layer Conductive Substrate
High-Frequency Mutual Impedance Extraction of Vlsi Interconnects in the Presence of a Multi-Layer Conducting Substrate
Application:
61/034,978 →
High-Frequency Vlsi Interconnect Impedance Extraction in the Presence of a Multi-Layer Conductive Substrate
Application:
61/053,660 →
Related Assignments
(1)
Other recorded transfers of the patents in this record — the chain of ownership.