IP Library › Patent Application 61053660
Patent Application Provisional
App. No. 61/053,660 · Confirmation No. 7475

HIGH-FREQUENCY VLSI INTERCONNECT IMPEDANCE EXTRACTION IN THE PRESENCE OF A MULTI-LAYER CONDUCTIVE SUBSTRATE

Inventor: Roberto Suaya
Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2008-06-11 APP.FILE.REC Filing Receipt 3 View
2008-05-15 TR.PROV Provisional Cover Sheet (SB16) 2 View
2008-05-15 SPEC Specification 99 View
2008-05-15 WFEE Fee Worksheet (SB06) 2 View
2008-05-15 N417 Electronic Filing System Acknowledgment Receipt 2 View
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Quick Facts
App. No.
61/053,660
Filed
2008-05-15