IP Library › Patent Application 61034978
Patent Application Provisional
App. No. 61/034,978 · Confirmation No. 8354

HIGH-FREQUENCY MUTUAL IMPEDANCE EXTRACTION OF VLSI INTERCONNECTS IN THE PRESENCE OF A MULTI-LAYER CONDUCTING SUBSTRATE

Inventor: Roberto Suaya
Provisional Application Expired
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 Code Description Pages PDF
2008-05-05 APP.FILE.REC Filing Receipt 3 View
2008-03-08 TR.PROV Provisional Cover Sheet (SB16) 2 View
2008-03-08 WFEE Fee Worksheet (SB06) 2 View
2008-03-08 N417 Electronic Filing System Acknowledgment Receipt 2 View
2008-03-08 SPEC Specification 18 View
2008-03-08 SPEC Specification 2 View
2008-03-08 SPEC Specification 7 View
2008-03-08 SPEC Specification 24 View
2008-03-08 SPEC Specification 2 View
2008-03-08 SPEC Specification 3 View
2008-03-08 SPEC Specification 13 View
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Quick Facts
App. No.
61/034,978
Filed
2008-03-08