IP Library Assignment 022560/0473
Patent Assignment
Reel/Frame 022560/0473

Assignment of Assignor's Interest

Recorded: 2009-04-17 Pages: 10
Assignors
ERK, HENRY F.
Executed: 2009-04-03
ALBRECHT, PETER D.
Executed: 2009-04-03
HOLLANDER, EUGENE R.
Executed: 2009-04-06
DOANE, THOMAS E.
Executed: 2009-04-08
SCHMIDT, JUDITH A.
Executed: 2009-04-09
VANDAMME, ROLAND R.
Executed: 2009-04-16
ZHANG, GUOQIANG (DAVID)
Executed: 2009-04-03
Assignee
MEMC ELECTRONIC MATERIALS, INC.
501 PEARL DRIVE, MAIL ZONE 33, ST. PETERS, MISSOURI, 63376-5000
Covered Property (1)
Edge Etched Silicon Wafers
Patent: 8,192,822 →
Application: 12/415,555 →
Publication: US 2009/0246444
Related Assignments (9)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Apr 1, 2011
From: MEMC ELECTRONIC MATERIALS, INC.; SUNEDISON LLC; SOLAICX
To: BANK OF AMERICA, N.A.
Reel/Frame 026064/0720 →
Security Agreement Oct 1, 2012
From: NVT, LLC; SUN EDISON LLC; SOLAICX, INC.; MEMC ELECTRONIC MATERIALS, INC.
To: GOLDMAN SACHS BANK USA
Reel/Frame 029057/0810 →
Release of Security Interest Dec 26, 2013
From: BANK OF AMERICA, N.A.
To: ENFLEX CORPORATION; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0031 →
Release of Security Interest Dec 26, 2013
From: GOLDMAN SACHS BANK USA
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0092 →
Security Agreement Jan 30, 2014
From: SUNEDISON, INC.; SOLAICX; SUN EDISON, LLC; NVT, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 032177/0359 →
Release of Security Interest Mar 3, 2014
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC.
Reel/Frame 032382/0724 →
Assignment of Assignor's Interest May 27, 2014
From: MEMC ELECTRONIC MATERIALS, INC.
To: SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)
Reel/Frame 033023/0430 →
Notice of License Agreement Jun 6, 2014
From: SUNEDISON SEMICONDUCTOR LIMITED
To: SUNEDISON SEMICONDUCTOR TECHNOLOGY PTE. LTD.
Reel/Frame 033099/0001 →
Assignment of Assignor's Interest Jun 7, 2018
From: SUNEDISON SEMICONDUCTOR LIMITED; MEMC JAPAN LIMITED; MEMC ELECTRONIC MATERIALS S.P.A.
To: GLOBALWAFERS CO., LTD.
Reel/Frame 046327/0001 →