Patent Assignment
Reel/Frame 022575/0982
Merger
Recorded: 2009-04-21
Pages: 6
Assignor
CHIPPAC INC.
Executed: 2009-04-17
Assignee
STATS CHIPPAC, INC.
47400 KATO ROAD, FREMONT, CALIFORNIA, 94538
Covered Property
(1)
Semiconductor Multi-Package Module Having Inverted Land Grid Array (Lga) Package Stacked Over Ball Grid Array (Bga) Package
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 28, 2004
From: KARNEZOS, MARCOS
To: CHIPPAC, INC.
Reel/Frame 014288/0190 →
Assignment of Assignor's Interest
Apr 30, 2009
From: STATS CHIPPAC, INC.
To: STATS CHIPPAC LTD.
Reel/Frame 022619/0153 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0400 →
Release of Security Interest
Jun 16, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052950/0497 →
Corrective Assignment to Correct the Assignee's Name Previously Recorded at Reel: 038378 Frame: 0400. Assignor(S) Hereby Confirms the Assignment.
Sep 5, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064806/0593 →