Patent Assignment
Reel/Frame 022589/0964
Assignment of Assignor's Interest
Recorded: 2009-04-23
Pages: 6
Assignors
MCELREA, SIMON J. S.
Executed: 2009-04-01
ROBINSON, MARC E
Executed: 2009-04-15
ANDREWS, LARWRENCE DOUGLAS, JR
Executed: 2009-04-15
Assignee
VERTICAL CIRCUITS, INC.
10 VICTOR SQUARE, SCOTTS VALLEY, CALIFORNIA, 95066
Covered Property
(1)
Support Mounted Electrically Interconnected Die Assembly
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 24, 2012
From: VERTICAL CIRCUITS, INC.
To: VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Reel/Frame 029186/0755 →
Assignment of Assignor's Interest
Dec 6, 2012
From: VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
To: INVENSAS CORPORATION
Reel/Frame 029458/0905 →
Assignment of Assignor's Interest
Mar 19, 2013
From: VERTICAL CIRCUITS, INC.
To: VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Reel/Frame 030055/0534 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →