Patent Assignment
Reel/Frame 030055/0534
Assignment of Assignor's Interest
Recorded: 2013-03-19
Pages: 5
Assignor
VERTICAL CIRCUITS, INC.
Executed: 2012-12-18
Assignee
VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
1100 LA AVENIDA STREET, BUILDING A, MOUNTAIN VIEW, CALIFORNIA, 94043
Covered Property
(1)
Support Mounted Electrically Interconnected Die Assembly
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 23, 2009
From: MCELREA, SIMON J. S.; ROBINSON, MARC E; ANDREWS, LARWRENCE DOUGLAS, JR
To: VERTICAL CIRCUITS, INC.
Reel/Frame 022589/0964 →
Assignment of Assignor's Interest
Oct 24, 2012
From: VERTICAL CIRCUITS, INC.
To: VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Reel/Frame 029186/0755 →
Assignment of Assignor's Interest
Dec 6, 2012
From: VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
To: INVENSAS CORPORATION
Reel/Frame 029458/0905 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →