Patent Assignment
Reel/Frame 022599/0221
Assignment of Assignor's Interest
Recorded: 2009-04-24
Pages: 5
Assignors
KIM, JOON SU
Executed: 2009-04-23
HO, MUN GIL
Executed: 2009-04-23
YANG, YONG SUK
Executed: 2009-04-23
PARK, JUNG SOO
Executed: 2009-04-23
KIM, BONG CHAN
Executed: 2009-04-23
Assignee
AMKOR TECHNOLOGY, INC.
1900 S. PRICE ROAD, CHANDLER, ARIZONA, 85248-1604
Covered Property
(1)
Wire Bonder for Improved Bondability of a Conductive Wire and Method Therefor
Patent:
7,938,308 →
Application:
12/429,448 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
Dec 6, 2012
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 029422/0178 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →