Patent Assignment
Reel/Frame 022619/0137
Assignment of Assignor's Interest
Recorded: 2009-04-30
Pages: 2
Assignor
STATS CHIPPAC, INC.
Executed: 2009-04-29
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Stacked Multi-Package Module Having Inverted Second Package
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 28, 2004
From: KARNEZOS, MARCOS
To: CHIPPAC, INC.
Reel/Frame 014288/0193 →
Merger
Apr 21, 2009
From: CHIPPAC INC.
To: STATS CHIPPAC, INC.
Reel/Frame 022575/0153 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0400 →
Release of Security Interest
Jun 16, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052950/0497 →
Corrective Assignment to Correct the Assignee's Name Previously Recorded at Reel: 038378 Frame: 0400. Assignor(S) Hereby Confirms the Assignment.
Sep 5, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064806/0593 →