Patent Assignment
Reel/Frame 022689/0001
Corrective Assignment to Correct the Assignee's Address Previously Recorded on Reel 022678 Frame 0466. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2009-05-15
Pages: 7
Assignor
UNITEST INC.
Executed: 2009-05-12
Assignee
WILL TECHNOLOGY CO., LTD.
216, IMOK-DONG, JANGAN-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Properties
(8)
Probe Structure for Testing Semiconductor Devices and Method for Fabricating the Same
Probe Card Having Deeply Recessed Trench and Method for Manufacturing the Same
Method for Manufacturing Probe Structure of Probe Card
Method for Manufacturing Bump of Probe Card
Method for Manufacturing Cantilever Structure of Probe Card
Method for Manufacturing Probe Structure of Probe Card
Method for Manufacturing Probe Structure
Method for Forming Bump of Probe Card
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 25, 2007
From: KIM, BONG WHAN; PARK, BUM JIN; KIM, JONG BOK; LEE, CHI WOO
To: UNITEST INC.
Reel/Frame 019608/0915 →
Assignment of Assignor's Interest
Aug 2, 2007
From: KIM, BONG HWAN; KIM, JONG BOK
To: UNITEST INC.
Reel/Frame 019637/0523 →
Assignment of Assignor's Interest
Aug 23, 2007
From: KIM, BONG HWAN; CHUN, KUKJIN; CHUNG, DOO-YUN; JEONG, CHI HWAN
To: UNITEST INCORPORATION
Reel/Frame 019740/0495 →
Assignment of Assignor's Interest
May 14, 2009
From: UNITEST INC.
To: WILL TECHNOLOGY CO., LTD.
Reel/Frame 022678/0466 →