Patent Assignment
Reel/Frame 022717/0369
Assignment of Assignor's Interest
Recorded: 2009-05-21
Pages: 18
Assignor
IRVINE SENSORS CORPORATION
Executed: 2009-03-16
Assignee
APROLASE DEVELOPMENT CO., LLC
2711 CENTERVILLE ROAD, SUITE 400, WILMINGTON, DELAWARE, 19808
Covered Property
(1)
Stackable Layers Containing Encapsulated Integrated Circuit Chips with One or More Overlying Interconnect Layers and a Method of Making the Same
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Apr 4, 2006
From: IRVINE SENSORS CORPORATION
To: SQUARE 1 BANK
Reel/Frame 017435/0142 →
Security Interest
Jan 5, 2007
From: IRVINE SENSORS CORP.
To: LONGVIEW FUND, L.P.; ALPHA CAPITAL ANSTALT
Reel/Frame 018746/0842 →
Security Interest
Nov 19, 2008
From: SQUARE 1 BANK
To: IRVINE SENSORS CORPORATION
Reel/Frame 021861/0531 →
Correction to the Security Interest Release Execution Date and Typographical Error Which Described This Release as a Security Agreement Rather Than as a Release of Security Agreement at Reel/Frame 021861/0531 and Recorded on 11/19/2008.
Jan 21, 2009
From: SQUARE 1 BANK
To: IRVINE SENSORS CORPORATION
Reel/Frame 022137/0609 →
Release of Security Interest
Jul 22, 2011
From: LONGVIEW FUND, L.P.; ALPHA CAPITAL ANSTALT
To: IRVINE SENSORS CORPORATION
Reel/Frame 026632/0405 →
Merger
Dec 30, 2015
From: APROLASE DEVELOPMENT CO., LLC
To: NYTELL SOFTWARE LLC
Reel/Frame 037406/0200 →