Patent Assignment
Reel/Frame 022794/0983
Assignment of Assignor's Interest
Recorded: 2009-06-08
Pages: 9
Assignors
SUTHIWONGSUNTHORN, NATHAPONG
Executed: 2009-05-25
MARIMUTHU, PANDI C.
Executed: 2009-05-27
KU, JAE HUN
Executed: 2009-05-27
OMANDAM, GLENN
Executed: 2009-05-26
GOH, HIN HWA
Executed: 2009-05-26
HENG, KOCK LIANG
Executed: 2009-05-25
CAPARAS, JOSE A.
Executed: 2009-05-26
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming an Interconnect Structure with Tsv Using Encapsulant for Structural Support
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0272 →
Release of Security Interest
Jun 9, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052879/0852 →
Corrective Assignment to Correct the the Assignee's Name Previously Recorded at Reel: 038378 Frame: 0272. Assignor(S) Hereby Confirms the Assignment.
Aug 31, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 065236/0730 →