Patent Assignment
Reel/Frame 022802/0675
Assignment of Assignor's Interest
Recorded: 2009-06-09
Pages: 5
Assignors
SHIM, IL KWON
Executed: 2009-06-05
CHOW, SENG GUAN
Executed: 2009-06-05
LIN, YAOJIAN
Executed: 2009-06-05
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Method of Forming Stress Relief Layer Between Die and Interconnect Structure
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0272 →
Release of Security Interest
Jun 11, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052907/0650 →
Corrective Assignment to Correct the the Assignee's Name Previously Recorded at Reel: 038378 Frame: 0272. Assignor(S) Hereby Confirms the Assignment.
Aug 31, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 065236/0730 →